CN JP
img
Semiconductor Products
Ceramic substrate precision machining service
Application
Provide precision engineering service on ceramic substrate used for image sensor packages. Printed Circuit Board ceramic substrates are used in image sensor packages for facial recognition, imaging, as well as air pressure sensor packages.
Optical sensor package substrate
Application
Optical sensor packaging substrate, the product has stringent visual requirements (point defects ≤ 6um), mainly used for CCD/CMOS sensor optical packaging of digital cameras.
Carrier glass substrate (used in support chip)
Application
Carrier glass substrate, which requires stringent specification of flatness and roughness used as a component of precision engineering of the biometric chip printed circuit board.
Copyright 2021 杭州美迪凱光電科技股份有限公司 浙ICP備17036298号-1
Powered By：HANSUN